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Application Area
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1. Main Test Anylayer HDI \ High-volume HDI. |
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2. Enduser Product Smartphone \ Tablet PC etc. |
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3.Compatibility Test IC substrates \ Moudles etc. |
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Technical Advantages
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1. Step&Repeat testing fuction can significantly improve the test yield of offset, swell-shrink PCB |
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2. CCD automatic alignment system can realize offset, swell-shrink PCB reliable |
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3. Universal clamping structure that can test special-shaped board |
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4. Four wire test function division of special line, defect line and reliable testing |
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5. Four rotary shuttles to match the high precision operation and compensation system can realize high speed and high precision testing |
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6. Fixture self-Iocking protection function can be achieved under the condition of power outages and other reliable protection |
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7. Standard and optional such as marking , flip ect. codereading personalized functions |
| Technical Specifications |
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| Test Capabilities |
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| Test object |
MH601:Anylayer HDI, high layer count HDI
MH601L:IC substrates, module boards |
| Test points |
MH601:Up 8192 points, down 8192 points
MH601L:Up 16384points, down 16384points |
| Product size |
MH601:260mm*200mm（Max） 60mm*50mm（Min）
MH601L:320mm*260mm（Max） 60mm*50mm（Min） |
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PCB thickness
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0.3~2.0mm |
| 2-wire test speed |
≥4000 points/s (under mason conditions) |
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Continuity test
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10Ω～100Ω
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| Insulation test |
1MΩ~100MΩ |
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Test voltage
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50V~250V
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| Test current |
20uA~20mA
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| Embedded resistance test |
10Ω~200KΩ |
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4-wire test speed
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≥1000 nets/s (under mason conditions) |
| Low resistance test |
0.3mΩ~200Ω |
| Fixture Specifications |
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| Min probe |
0.05mm |
| Fixture type |
Wire probe fixture/composite fixture/READ fixture |
| Fixture assembly/disassembly |
One-touch operation |
| Standard configuration |
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Positioning accuracy
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±7.5um |
| CCD quantity |
4 groups (2 groups for fixture alignment, 2 groups for PCB alignment) |
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PCB fixing method
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Universal substrate clamping tray |
| Loading & unloading tables |
LOAD、OPEN 、LEAK、PASS、PAPER |
| Other functions |
Dust removal function\tilt function\static removal |
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| Functions |
Laser marking, barcode reading |
| Operating Requiremen |
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Temperature
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18℃～25℃ |
| Humidity |
40%~60% |
| Power supply |
AC380V/50HZ ±5%25A |
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Air supply
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0.6-0.8MPa (Dry、Clear) |
| Other |
No Vibration、No Dust、No corrosive gases |
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Machine specifications
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Weight 3600KG, W2730*D1970*H1900mm |
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